真空镀膜
-
0/人使用者
-
0/次机时次数
-
0/小时总时长
-
0/次送样次数
-
0/人收藏者
-
收费标准
机时0元/小时 -
设备型号
-
当前状态
-
管理员
陈达睿 Jeff Darui CHEN -
放置地点
W3-325
- 仪器信息
- 预约资源
- 附件下载
- 公告
- 同类仪器
名称
真空镀膜
资产编号
325A13
型号
规格
产地
厂家
速普
所属品牌
出产日期
购买日期
所属单位
多功能高聚物薄膜中央实验室 Multi-functional Polymeric Membranes Research Facility
使用性质
科研
所属分类
资产负责人
--
联系电话
联系邮箱
pingtingli@hkust-gz.edu.cn
放置地点
W3-325
- 主要规格&技术指标
- 主要功能及特色
主要规格&技术指标
1.能实现超低功率磁控溅射（5-500W 功率可调可控）
2.配备 1 套射频远程等离子源，用于基片的活化、表面改性和污染物清洗。
3.样品尺寸：适合基片尺寸不小于 8 英寸直径。
4.配备贵金属+其他金属+半导体+其他氧化物靶材。
1. Able to achieve ultra-low power magnetron sputtering (adjustable and controllable power of 5-500W)
2. Equipped with one set of RF remote plasma source for substrate activation, surface modification, and pollutant cleaning.
3. Sample size: Suitable for substrate size not less than 8 inches in diameter.
4. Equipped with precious metals+other metals+semiconductors+other oxide target materials
2.配备 1 套射频远程等离子源，用于基片的活化、表面改性和污染物清洗。
3.样品尺寸：适合基片尺寸不小于 8 英寸直径。
4.配备贵金属+其他金属+半导体+其他氧化物靶材。
1. Able to achieve ultra-low power magnetron sputtering (adjustable and controllable power of 5-500W)
2. Equipped with one set of RF remote plasma source for substrate activation, surface modification, and pollutant cleaning.
3. Sample size: Suitable for substrate size not less than 8 inches in diameter.
4. Equipped with precious metals+other metals+semiconductors+other oxide target materials
主要功能及特色
采用高品质恒功率磁控溅射电源，确保恒定镀膜沉积速率。并配备自动旋转升降样品台，可加偏压和等离子体源用于基片的清洗、活化。特别适用于4-8英寸金属薄膜电极的制备，可实现好的薄膜厚度、性能均匀性以及优秀的薄膜附着力。
Using high-quality constant power magnetron sputtering power supply to ensure a constant coating deposition rate. And equipped with an automatic rotating lifting sample stage, which can apply bias voltage and plasma source for substrate cleaning and activation. Specially suitable for the preparation of 4-8 inch metal thin film electrodes, it can achieve good film thickness, uniform performance, and excellent film adhesion.
Using high-quality constant power magnetron sputtering power supply to ensure a constant coating deposition rate. And equipped with an automatic rotating lifting sample stage, which can apply bias voltage and plasma source for substrate cleaning and activation. Specially suitable for the preparation of 4-8 inch metal thin film electrodes, it can achieve good film thickness, uniform performance, and excellent film adhesion.
预约资源
附件下载
公告
同类仪器
